doc. no : qw0905- rev. : date : data sheet round type led lamps LDGM3633 ligitek electronics co.,ltd. property of ligitek only LDGM3633 14 - jun. - 2006 a pb lead-free parts
11.0 10.0 2.0 1.5max 13.5 0.5 typ 1.0min 2.54typ 25.0min + - directivity radiation note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. page 1/5 ligitek electronics co.,ltd. property of ligitek only part no. LDGM3633 package dimensions 100%50% 75%25% -60 -30 025%50%75%100% 0 30 60
note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. absolute maximum ratings at ta=25 i fp pd i f tstg t opr esd symbol typical electrical & optical characteristics (ta=25 ) power dissipation reverse current @5v electrostatic discharge( * ) storage temperature operating temperature parameter peak forward current duty 1/10@10khz forward current 120 -30 ~ +100 -20 ~ +80 ir 150 50 ratings dgm 100 30 mw v a ma ma unit ligitek electronics co.,ltd. property of ligitek only page2/5 16 viewing angle 2 1/2 (deg) min. 7700 20 typ. 3.5 forward voltage @ ma(v) max. 4.0 peak wave length pnm 518 spectral halfwidth nm 36 typ. luminous intensity @20ma(mcd) 14000 emitted green part no LDGM3633 material ingan/gan lens color water clear dominant wave length dnm 525 static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. * part no. LDGM3633
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 450550600 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 500 dgm chip 3/5 page part no. LDGM3633
page 4/5 ligitek electronics co.,ltd. property of ligitek only 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time) distance:2mm min(from solder joint to body) 260 c3sec max 5 /sec max temp( c) 260 150 2 /sec max 60 seconds max 0 preheat 100 50 time(sec) 0 25 120 dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) part no. LDGM3633
5/5 page ligitek electronics co.,ltd. property of ligitek only mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 mil-std-883:1008 jis c 7021: b-10 reference standard jis c 7021: b-12 mil-std-202:103b jis c 7021: b-11 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 description test condition 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. test item operating life test high temperature storage test reliability test: 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) the purpose of this test is the resistance of the device under tropical for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs low temperature storage test high temperature high humidity test thermal shock test the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 1.t.sol=230 5 2.dwell time=5 1sec this test intended to see soldering well performed or not. solderability test mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.t.sol=260 5 2.dwell time= 10 1sec. solder resistance test part no. LDGM3633
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